Front-loading and rear-loading methods, compatible with docking station for improved operator efficiency and production cycle time
Internationally leading dual die bonding, dual dispensing, and dual wafer search systems
Direct-drive motor for bonding head operation
Linear motor driven wafer search platform (X/Y) and feed platform (B/C)
Automatic angle correction system for wafer frame
Automatic wafer ring loading/unloading system for enhanced production efficiency
Precision automation ensures improved production efficiency and reduced operational costs

Technical Specifications

Production Cycle	150ms (depends on chip size and bracket)
XY Accuracy	±1mil (±0.025mm)
Die Rotation	±3°
Die XY Workbench
Die Dimensions	3mil×3mil-80mil×80mil (0.076mm×0.076mm-2mm×2mm)
Max. Angle Correction	±15°
Max. Die Ring Size	6″ (152mm) outer diameter
Max. Die Area	4.7″ (119mm) after expansion
Resolution Ratio	0.04mil (1μm)
Thimble Z Height Stroke	80mil (2mm)
Image Recognition System
Grey Scale	256 (Level Grey)
Resolution	720(H)×540(V)(Pixels)
Die Bonder's Swing Arm-and-hand System
Swing Arm of Die Bonder	105° rotatable die bonding
Die Bond Pressure	Adjustable 30g-250g
Loading Workbench
Range of Stroke	500mm×120mm
XY Resolution	0.02mil (0.5μm)
Suitable Holder's Size
Length	300mm-500mm
Width	80mm-120mm
Facilities Needed
Voltage/Frequency	220V AC±5%/50HZ
Compressed Air	0.5MPa (MIN)
Rated Power	1200W
Gas Consumption	40L/min
Volume and Weight
Dimensions (L×W×H)	1900×980×1620mm
Weight	1200KG

Frequently Asked Questions

Is this machine easy to operate for first-time users?

An English manual and guide video are provided to demonstrate machine operation. For additional questions, contact us via email, Skype, phone, or our online trade manager service.

What if the machine has problems after delivery?

We provide free replacement parts during the warranty period. For parts under 0.5KG, we cover postage; for heavier parts, the customer pays shipping.

What is the minimum order quantity?

Minimum order is 1 machine, and mixed orders are welcome.

How can I purchase this machine?

Consult with us online or via email
Negotiate and confirm final price, shipping, and payment terms
Receive and confirm proforma invoice
Make payment as specified
We prepare your order after full payment confirmation
100% quality check before shipping
Delivery by air or sea

Why choose our company?

We are the actual manufacturers
Over ten years of experience in the machine industry
Commitment to high quality and timely delivery
24-hour after-sales support

Tags:

Máquina de ensaio de luz LED

Estação de reelaboração BGA infravermelha

Transportador de manuseio de PCB

Detalhes dos produtos

Casa > produtos >

maquinaria da produção da eletrônica

Fully Automatic High Precision Flip Chip Die Bonder Machine with 150ms Cycle and ±1mil Accuracy for SMT Production Line

Todas as categorias

Máquina da picareta e do lugar

forno do reflow

Máquina de SMT AOI

Máquina de impressão de pasta de solda

Máquina SMT SPI

Linha da máquina de SMT

Máquina de inserção automática

Máquina de soldadura por ondas

Carregador e descarregador de PCB

transporte do smt

Máquina de distribuição de cola

Máquina de revestimento constituída

Máquina de curar fornos

Máquina de corte do PWB

maquinaria da produção da eletrônica

Máquina de PCB

Fully Automatic High Precision Flip Chip Die Bonder Machine with 150ms Cycle and ±1mil Accuracy for SMT Production Line

MOQ:	1
preço:	$28,000-28,500

Informações detalhadas

Descrição do produto

Informações detalhadas

Peso:

1200 kg

Tempo de ciclo:

150ms

Precisão XY:

± 0,025 mm

Rotação da matriz:

± 3 °

Dimensões da matriz:

0,076 mm * 0,076 mm-2 mm * 2 mm

Correção de ângulo máximo:

± 15 °

Anel Max Die:

152 mm

Área máxima de matriz:

119 mm

taxa de resolução:

1 μm

Curso de dedal:

2mm

Escala de cinza:

256

Resolução da imagem:

720x540 pixels

Pressão de ligação:

30g-250g

Resolução XY:

0.5μm

Potência nominal:

1200W

Quantidade de ordem mínima:

Preço:

$28,000-28,500

Destacar:

150ms Cycle Die Bonder Machine

±1mil Accuracy Flip Chip Die Bonder Machine

±3° Die Rotation SMT Production Line Machine